Version | 1.0 |
Unit Name | Advanced Manufacturing and Industrial Automation |
Unit Code | MME509A |
Unit Duration | 1 Term (online) or 1 Semester (on-campus) |
Award |
Graduate Diploma of Engineering (Mechanical) Master of Engineering (Mechanical) |
Year Level | One |
Unit Coordinator MME Course Coordinator |
Dr Milind Siddhpura |
Common/Stream/Elective: |
Elective |
Pre/Co-requisites | Nil |
Credit Points |
3 Grad Dip total course credit points = 24 Masters total course credit points = 48 |
Mode of Delivery | Online or on-campus. |
Unit Workload |
Student workload including “contact hours” = 10 hours per week: Lecture – 1 hour Tutorial – 1 hour Practical / Lab – 1 hour (if applicable) Personal Study recommended – 7 hours |
Unit Description and General Aims
This unit covers a wide range of advanced manufacturing and automation topics. It begins with Rapid Prototyping and Additive Manufacturing (AM), then explores Integrated Circuit (IC) processing and Electronics Assembly/Packaging. Microfabrication and Nanofabrication Technologies are introduced. The unit also covers Assembly Automation and Robotics, followed by Control Systems. Lastly, it explores Smart Manufacturing and Sustainability.
Learning Outcomes
On successful completion of this Unit, students are expected to be able to:
- Select a methodology for selecting appropriate 3D printing technology for different products
- Bloom’s Level 5
- Assess PCB Assembly Techniques and methods to optimize efficiency and cost-effectiveness.
- Bloom’s Level 5
- Select the appropriate fabrication techniques for manufacturing micro/nano devices and structures
- Bloom’s Level 5
- Assess the incorporation of Automation and Robotics in Industrial Operations, Emphasizing Safety and Productivity.
- Bloom’s Level 5
- Evaluate data analytics techniques in smart manufacturing for quality improvement and process efficiency.
- Bloom’s Level 5
- Create Models for Sustainable Product Design, Development, and Manufacturing.
- Bloom’s Level 6
Student assessment
Assessment Type |
When assessed (e.g. Week 5) |
Weistughting (% of total unit marks) |
Learning Outcomes Assessed |
Assessment 1 Type: Weekly Quizzes Description: Students will need to complete multiple-choice quiz questions to demonstrate a good understanding of the fundamental concepts. Topics covered: 2-11. |
Weekly |
10% |
All |
Assessment 2 Type: Test (Invigilated) Description: Short/Long answers and Problems to solve Topics covered: 1-4 |
During Topic/Week 5 or 6 |
25% |
1,2,3 |
Assessment 3 Type: Practical (Report) and Demonstration Description: Topics covered: 1-7 |
After Topic 7 |
25% |
1,2,3,4 |
Assessment 4 Type: Research (Report) and Presentation Description: A complete report with sections on: methodology, implementation / evaluation, verification / validation, conclusion / challenges and recommendations / future work Word length: 3000, excluding diagrams and references. Topics covered: All |
Final Week |
35% |
All |
Attendance / Tutorial Participation Description: Presentation, discussion, group work, exercises, self-assessment/reflection, case study analysis, application. |
Continuous |
5% |
All |
Prescribed and Recommended readings
Prescribed Textbooks:
- Groover, M. P. Fundamentals of Modern Manufacturing: Materials, Processes and Systems, 7th Edition, 2019, Wiley
- Craig, J. J. Introduction to Robotics: Mechanics and Control, 4th Edition, 2020, Pearson
Reference Materials:
- Boothroyd, G., Dewhurst, P., & Knight, W. A. Product Design for Manufacture and Assembly, 3rd Edition, 2010, CRC Press
- Bolton, W. Pneumatic and Hydraulic, 1997, Butterworth-Heinemann Ltd
Unit Content
One topic is delivered per contact week:
Topic 1
Rapid Prototyping and Additive Manufacturing:
- Introduction to Rapid Prototyping and Additive Manufacturing (AM)
- Types of 3D printing technologies
- Materials in AM
- Applications and case studies in AM
Topic 2
Processing of Integrated Circuits
- Overview of IC Processing
- Silicon Processing
- Lithography, Layer Processes Used in IC Fabrication
- Integrating the Fabrication Steps, IC Packaging, Yields in IC Processing
Topic 3
Electronics Assembly and Packaging
- Electronics Packaging
- Printed Circuit Boards
- Printed Circuit Board Assembly
- Surface-Mount Technology
- Electrical Connector Technology
Topic 4
Microfabrication Technologies
- Microsystem Products
- Microfabrication Processes
Topic 5
Nanofabrication Technologies
- Nanotechnology Products
- Introduction to Nanoscience
- Nanofabrication Processes
Topic 6
Assembly Automation
- Overview of assembly processes and automation
- Importance and benefits of automation
- Types of assembly automation systems
- Case Studies
Topic 7
Robotics I
- Introduction to industrial robotics
- Applications and programming
Topic 8
Robotics II
- Robot kinematics
- Dynamics of Industrial Robots
Topic 9
Control Systems for Automation
- Sensors and actuators
- Programmable Logic Controllers (PLCs)
- Supervisory Control and Data Acquisition (SCADA) systems
- Human-Machine Interface (HMI) design
- Control strategies and algorithms
Topic 10
Basics of smart manufacturing.
- Basics of smart manufacturing
- Internet of Things (IoT) in manufacturing
- Data analytics and predictive maintenance
- Implementation of smart manufacturing and Industry 4.0 in industry
Topic 11
Sustainable and Green Manufacturing:
- Principles of sustainable manufacturing
- Resource-efficient manufacturing processes
- Recycling, waste reduction, and eco-design
- Case studies in sustainable and green manufacturing
Topic 12
Recent Trends and Unit Review
- Recent trends and future scopes
- Unit review
Engineers Australia
The Australian Engineering Stage 1 Competency Standards for the Professional Engineer, approved as of 2013. This table is referenced in the mapping of graduate attributes to learning outcomes and via the learning outcomes to student assessment.
Stage 1 Competencies and Elements Competency | |
1. | Knowledge and Skill Base |
1.1 | Comprehensive, theory based understanding of the underpinning natural and physical sciences and the engineering fundamentals applicable to the engineering discipline. |
1.2 | Conceptual understanding of the mathematics, numerical analysis, statistics, and computer and information sciences which underpin the engineering discipline. |
1.3 | In-depth understanding of specialist bodies of knowledge within the engineering discipline. |
1.4 | Discernment of knowledge development and research directions within the engineering discipline. |
1.5 | Knowledge of engineering design practice and contextual factors impacting the engineering discipline. |
1.6 | Understanding of the scope, principles, norms, accountabilities and bounds of sustainable engineering practice in the specific discipline. |
2. | Engineering Application Ability |
2.1 | Application of established engineering methods to complex engineering problem solving. |
2.2 | Fluent application of engineering techniques, tools and resources. |
2.3 | Application of systematic engineering synthesis and design processes. |
2.4 | Application of systematic approaches to the conduct and management of engineering projects. |
3. | Professional and Personal Attributes |
3.1 | Ethical conduct and professional accountability. |
3.2 | Effective oral and written communication in professional and lay domains. |
3.3 | Creative, innovative and pro-active demeanor. |
3.4 | Professional use and management of information. |
3.5 | Orderly management of self and professional conduct. |
3.6 | Effective team membership and team leadership. |
Software/Hardware Used
Software: Matlab, Excel, SolidWorks, Automation Studio
Hardware: NA